Semiconductor Manufacturing International Corporation (OTCQX:SIUIF) Q1 2025 Earnings Conference Call May 8, 2025 8:30 PM ET
Company Participants
Guo Guangli – Senior Vice President and Board Secretary
Wu Junfeng – Senior Vice President and Person In Charge of Finance
Zhao Haijun – Co-Chief Executive Officer
Conference Call Participants
Leping Huang – Huatai Securities
Xiaofei Zhang – Haitong
Ziyuan Wang – CITIC Securities
Operator
Welcome to Semiconductor Manufacturing International Corporation’s First Quarter 2025 Webcast Conference Call. Today’s call will be simultaneously stream through Internet and telephone. [Operator Instructions]
Without further ado, I would like to introduce Ms. Guo Guangli, Senior Vice President and Board Secretary to host the webcast.
Guo Guangli
Greetings. Welcome to SMIC’s first quarter 2025 webcast conference call. Attending today’s call are Dr. Zhao Haijun, Co-Chief Executive Officer; Dr. Wu Junfeng, Senior Vice President and Person In Charge of Finance.
Let me remind you that today’s presentation may contain forward-looking statements that do not guarantee future performance but represent the company’s expectations and are subject to inherent risks and uncertainties. Please refer to the forward-looking statements in our earnings announcement. Please note that today’s earnings statement is presented in accordance with International Financial Reporting Standards, IFRS and all currency figures are in U.S. dollars, unless otherwise stated.
I will now hand the call to Dr. Wu Junfeng to introduce the company’s financial status.
Wu Junfeng
First, I will report our unaudited results for the first quarter of 2025, followed by our guidance for the second quarter of 2025.
The first quarter results are as follows: revenue was $2,247 million, up 1.8% sequentially. Gross margin was 22.5%, down 0.1 percentage points sequentially. Profit from operations was $310 million. EBITDA was $1,292 million.
EBITDA margin was 57.5%. Profit attributable to the company was $188 million. Moving to the balance sheet. At the end of
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